Liqui-Bond EA 1805

Liqui-Bond® EA 1805 is a two-component, epoxy based, liquid-dispensable adhesive. Liqui-Bond® EA 1805 has a thermal conductivity of 1.8 W/mK.

Liqui-Bond® EA 1805 will be supplied in a two-component format, and refrigeration is not required.

Liqui-Bond® EA 1805 has a high bond strength with room temperature cure that can be accelerated with additional heat. The high bond strength eliminates the need for fasteners and maintains structural bond in severe environments. Recommended usage is filling any surface irregularities between heat sources and heat spreaders of similar metallic surfaces. Liqui-Bond® EA 1805 is thixotropic and will remain in place during dispensing, and the material will flow easily under minimal pressure resulting in minimum bondline with very low stress on fragile components during assembly.


  • Room temperature cure
  • Room temperature storage
  • Thermal Conductivity: 1.8 W/m-K
  • Eliminates need for mechanical fasteners
  • Maintains structural bond in severe-environment applications
  • Excellent chemical and mechanical stability


  • LED Lighting
  • Power supplies
  • Discrete component to heat spreader
  • Automotive Lighting
  • White goods
Liqui-Bond EA 1805 Downloads

SDS 简体中文
SDS English EU
SDS English US
SDS Deutsch
SDS 日本語
SDS 한국어
SDS Português
SDS Русский

Applications Electrically Conductive Thermal Materials