Hi-Flow 225F-AC is a high performance, thermal interface material for use between a computer processor and a heat sink. Hi-Flow 225F-AC consists of a soft, thermally conductive 55°C phase change compound coated to the top surface of an aluminum carrier with a soft, thermally conductive adhesive compound coated to the bottom surface to improve adhesion to the heat sink.
Above the 55°C phase change temperature, Hi-Flow 225F-AC wets-out the thermal interface surfaces and flows to produce low thermal impedance.
Hi-Flow 225F-AC requires pressure from the assembly to cause material flow. The Hi-Flow coatings resist dripping in vertical orientation.
The material includes a base carrier liner with differential release properties to facilitate simplicity in roll form packaging and application assembly. Please contact Product Management for applications that are less than 0.07” square.
- Thermal impedance: 0.10°C-in²/W (@25 psi)
- Can be manually or automatically applied to the surfaces of room-temperature heat sinks
- Foil reinforced, adhesive coated
- Soft, thermally conductive 55°C phase change compound
- Computer and peripherals
- Power conversion
- High performance computer processors
- Power semiconductors
- Power modules
Standard Configuration (Metric)
Standard Configuration (Imperial)
Halogen Testing Report
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