Hi-Flow 565U

Hi-Flow 565U is a thermally conductive phase change material which is applied in tabulated pad form. In the application the easy to use material undergoes a phase change at 52°C. After phase change, Hi-Flow 565U wets out the thermal interfaces resulting in a very low thermal impedance.

Hi-Flow 565U displaces easily at low pressures to provide a thermal performance comparable to the best thermal greases. Hi-Flow 565U is provided at a consistent thickness to ensure reliable performance. Hi-Flow 565U is attached to the target surface via pressure from a hard rubber roller or squeegee.


Your benefits

  • Thermal impedance: 0.04°C-in²/W (@25 psi)
  • Very high thermal conductivity: 3.5 W/mK
  • 52°C phase change temperature
  • Unsupported

Applications

  • Processor lid to heat sink
  • Processor die to lid or heat sink 
  • FBDIMM to heat spreader
Hi-Flow 565U Downloads

Selection Guide
RoHS Certificate
Halogen Testing Report
SDS 简体中文
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