Hi-Flow 625

Hi-Flow 625 is a film-reinforced phase change material. The product consists of a thermally conductive 65°C phase change compound coated on PEN film. Hi-Flow 625 is designed to be used as a thermal interface material between electronic power devices that require electrical isolation and a heat sink. The reinforcement makes Hi-Flow 625 easy to handle, and the 65°C phase change temperature of the coating material eliminates shipping and handling problems. The PEN film has a continuous use temperature of 150°C.

Hi-Flow 625 is tack-free and scratch resistant at production temperature and does not require a protective liner in most shipping situations. The material has the thermal performance of 2-3 mil mica and grease assemblies.


Your benefits

  • Thermal impedance: 0.71°C-in²/W (@25 psi)
  • Electrically isolating
  • 65°C phase change compound coated on PEN film
  • Tack-free and scratch-resistant

Applications

  • Spring / clip mounted
  • Power semiconductors
  • Power modules
Hi-Flow 625 Downloads

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Standard Configuration (Metric)
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