Gap Pad 1500

Gap Pad 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains optimal thermal performance yet still allows for easy handling. The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial resistance.

Your Benefits

  • Thermal conductivity: 1.5 W/m-K
  • Un-reinforced construction for additional compliancy
  • Conformable, low hardness
  • Electrically isolating


  • Telecommunications
  • Computer and peripherals
  • Power conversion
  • RDRAM™ memory modules / chip scale packages
  • Areas where heat needs to be transferred to a frame chassis, or other type of heat spreader
Gap Pad 1500 Downloads

Selection Guide
RoHS Certificate
Halogen Testing Report
SDS English EU
SDS Deutsch
SDS Italiano
Application Note 116

Applications Thermal Pads