Gap Pad HC3.0
Gap Pad® HC 3.0 is a soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation. The enhanced material is well suited for high performance applications requiring low assembly stress. Gap Pad® HC 3.0 maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography.
Gap Pad® HC 3.0 is offered with natural inherent tack on one side of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. Gap Pad® HC 3.0 is supplied with protective liners on both sides.
- Thermal conductivity: 3.0 W/m-K
- Highly conformable, low compression stress
- Fiberglass reinforced for shear and tear resistance
- Consumer electronics
- ASICs and DSPs
- Thermal modules to heat sinks
SDS English US