Gap Pad 2202SF
Gap Pad® 2202SF is a high performance, 2.0 W/m-K, thermally conductive gap filling material. The Gap Pad® 2202SF compound is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces.
Gap Pad® 2202SF is specifically designed for silicone-sensitive applications. The material's construction features a 0.5 mil PET film on one side and natural tack on the other. The natural tack eliminates the need for an additional adhesive layer.
- Thermal conductivity: 2.0 W/m-K
- Silicone-free formulation
- Minimal compression set
- 0.5 mil film provides tack-free surface
- Tacky side allows for ease of handling and placement
- Hard drives
- Optical applications
- Set top boxes
Halogen Testing Report
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