Gap Pad 2202SF

Gap Pad® 2202SF is a high performance, 2.0 W/m-K, thermally conductive gap filling material. The Gap Pad® 2202SF compound is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces.

Gap Pad® 2202SF is specifically designed for silicone-sensitive applications. The material's construction features a 0.5 mil PET film on one side and natural tack on the other. The natural tack eliminates the need for an additional adhesive layer.

Your Benefits

  • Thermal conductivity: 2.0 W/m-K
  • Silicone-free formulation
  • Minimal compression set
  • 0.5 mil film provides tack-free surface
  • Tacky side allows for ease of handling and placement


  • Hard drives
  • Optical applications
  • Set top boxes
Gap Pad 2202SF Downloads

Data Sheet
RoHS Certificate
Halogen Testing Report
SDS 简体中文
SDS English EU
SDS Deutsch

Applications Thermal Pads