Gap Pad VO

Gap Pad VO is a cost effective thermally conductive interface. The material is a filled thermally conductive polymer supplied on a rubber coated fiberglass carrier allowing for easy material handling. The conformable nature of Gap Pad VO allows the pad to fill in air gaps between PC boards and heat sinks or a metal chassis.

Your Benefits

  • Thermal conductivity: 0.8 W/m-K
  • Enhanced puncture, shear, and tear resistance
  • Easy material handling
  • Electrically isolating


  • Telecommunications
  • Computer and peripherals
  • Power conversion
  • Between heat-generating semiconductors and a heat sink
  • Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
  • Between heat-generating magnetic components and a heat sink
Gap Pad VO Downloads

Selection Guide
RoHS Certificate
Halogen Testing Report
SDS English EU
Application Note 116

Applications Thermal Pads