Gap Pad VO Soft

Gap Pad VO Soft is recommended for applications that require a minimum amount of pressure on components. Gap Pad VO Soft is a highly conformable, low modulus, filled-silicone polymer on a rubber-coated fiberglass carrier. The material can be used as an interface where one side is in contact with a leaded device.


Your benefits

  • Thermal conductivity: 0.8 W/m-K
  • Conformable, low hardness
  • Enhanced puncture, shear and tear resistance
  • Electrically isolating

Applications

  • Telecommunications
  • Computer and peripherals
  • Power conversion
  • Between heat-generating semiconductors or magnetic components and a heat sink
  • Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
Gap Pad VO Soft Downloads

Selection Guide
RoHS Certificate
Halogen Testing Report
SDS 简体中文
SDS English EU
SDS 日本語
Application Note 116

Applications Thermal Pads