Liqui-Form 2000

Liqui-Form® 2000 is a high thermal conductivity liquid formable material designed for demanding applications requiring a balance between dispensability, low component stresses during assembly and ease of rework.

Liqui-Form® 2000 is a highly conformable shear-thinning material which requires no curing, mixing or refrigeration. Its unique formulation assures excellent thermal performance, low applied stress and reliable long-term performance. Liqui-Form® 2000 is thixotropic and has a natural tack ensuring it forms around the component and stays in place in the application.


Your benefits

  • Thermal Conductivity: 2.0 W/m-K
  • Applies very low force on components during assembly
  • Low volumetric expansion
  • Excellent chemical and mechanical stability even at higher temperatures
  • No curing required
  • Stable viscosity in storage and in the application

Applications

  • Bare die to heat spreader lid
  • Filling various gaps between heat-generating devices to heat sinks and housings
  • Devices requiring low assembly pressure
  • BGA, PGA, PPGA
Liqui-Form 2000 Downloads

RoHS Certificate
Halogen Testing Report
SDS 简体中文
SDS English EU
SDS Deutsch
SDS Tagalog

Applications Electrically Conductive Thermal Materials