Thermal Clad Metal Core PCB’s (MCPCB’s) minimize thermal impedance and conduct heat more effectively than standard printed wiring boards (PWB's).These substrates are more mechanically robust than thick-film ceramic and direct bond copper construction.
Thermal Clad is a cost-effective solution which can eliminate components, allow for simplified designs, smaller devices and an overall less complicated production process. Additional benefits of Thermal Clad include lower operating temperatures, resulting in longer component life and increased durability.
The technology of Thermal Clad resides in the dielectric. This datasheet highlights the performance characteristics of Thermal Clad HR T30.20, with twenty plus year's industry proven dielectric for a multitude of applications including LED, Power Conversion, Heat-Rails, Solid State Relays and Motor Drives.
- Thermal conductivity 1.5 W/m-K, 4x FR4
- Thermal impedance 0.15° C-in²/W (0.97°C-cm²/W)
- Available as laminate only
- High dielectric strength
- High reliability
- Available worldwide
- High Power LED applications
- Power conversion
- Solid state relays
- Motor drives
- LED applications