LOCTITE ABLESTIK CDF 800 Series Conductive Die Attach Film

(Known as Ablestik CDF 815P6B )

LOCTITE ABLESTIK CDF 800 Series are high filled, conductive die attach adhesive film designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes.   It exhibits strong adhesion to various wafer metallizations and leadframe finishes.  It can be used in a variety of die sizes ranging from 0.2mm x 0.2mm to 4mm x 4mm.

KEY BENEFITS:

  • High MSL reliability
  • Controlled fillet size
  • No resin bleed-out
  • Consistent bondline thickness
  • Pre-cut wafer lamination equipment compatible
  • Recommended for thin wafer handling applications
  • Excellent in-package thermal and electrical resistance


Applications Leaded Package CDAF Electrically Conductive Film