LOCTITE HF 212

LOCTITE HF 212 Applications

Solder Paste for Medium and Large Board Assemblies
LOCTITE HF 212 is a halogen-free solder paste that withstands the thermal demands inherent with larger assemblies.  High reliability and a wide reflow process window are at the foundation of this material, ensuring its outstanding performance for the most demanding high value PCB applications.

Halogen Free 

  • Meets all current “Halogen-free” restrictions
  • No added Halogen
  • Halide-free: ROL0 classification in accordance to j-STD-004B
  • Compatible with existing halogen-free solutions

Ease of Application

  • Excellent wetting capabilities

Technology Printing and Reflow Advantages

  • Wide process window for printing and minimal slump
  • Fine pitch capability and reduction in solder bridging
  • Excellent abandon time and stencil life
  • Excellent humidity resistance
  • Excellent solderability on challenging surface finishes (includes CuNiZn and Copper OSP)
  • Improves fine pitch coalescence

Low Voiding

  • In CSP
  • On industry surface finishes: ENIG, Copper OSP, CuNiZn and Imm Ag
  • Increases solder joint reliability

> View the LOCTITE HF 212 landing page


Technical Data Sheets (TDS)

Loctite HF 212
PDF

Additional Documents

LOCTITE MULTICORE HF 212
PDF
ENGINEERING MANUAL HF212 SOLDER PASTE
PDF
High Reliability Pb-Free Solder Alloy Sell Sheet
PDF
Solder Materials Solutions Guide
PDF