LOCTITE ABLESTIK SSP 2020

LOCTITE ABLESTIK SSP 2020 is a sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity.  It is formulated to provide high heat transfer generated from power devices.  It maintains high adhesion at operating temperatures as high as 260°C.  It is stencil printable and syringe dispensable.

KEY BENEFITS:

  • Ideal for high power devices
  • Delivers a robust intermetallic bond between targeted surfaces
  • Facilitates much higher thermal and electrical conductivity than traditional die attach adhesives
  • Strong adhesion
  • Compatible with current production equipment, high throughput
  • 10x thermal cycle & power cycle performance better than solder



Applications Die Attach Adhesives Electrically Conductive