LOCTITE ECCOBOND DP 1012UV is a one component material designed for use as a wire and tab bond lead encapsulant or damming material.  This adhesive cures in seconds when exposed to the appropriate intensity of UV light.  It can be co-cured with low viscosity LOCTITE ECCOBOND UV1003UV fill encapsulant.  It maintains adhesion to silicon, wide variety of metals and plastics when thermal cycled.  It may be applied by Asymtek jet and air over syringe dispensing.

Applications Electronically Non-Conductive Pastes