LOCTITE ECCOBOND DP 1003UV
LOCTITE ECCOBOND DP 1003UV one component material is designed for use as a wire and tab bond lead encapsulant, and gap fillng adhesive. It can be applied by using non-contact dispensing methods. This adhesive cures in seconds when exposed to the appropriate intensity of UV light. It has very high flow to facilitate penetration of small gaps. It can be co-cured with ECCOBOND DP 1002UV for dam and fill applications. It maintains adhesion to silicon, a wide variety of metals and plastics when thermal cycled. It provides environmental and mechanical protection.
Fill Materials - Package