LOCTITE ABLESTIK ABP 8611

(Known as ABLESTIK ABP 8611 Die attach adhesive )

LOCTITE ABLESTIK ABP 8611 adhesive is designed for die attach applications as well as component attach.  Its high dielectric property helps eliminate current leakage and short circuit occurence in the package.  It is formulated with a high modulus and adhesion making the material suitable for use on copper wire bonding process where die shift issues can be effectively avoided.


Applications Leaded Packages Electrically Non-Conductive Paste