LOCTITE ABLESTIK 8387B

(Known as Ablebond 8387B )

LOCTITE ABLESTIK 8387B is a non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This adhesive can be fast cured using directed heat energy energy or hot plate curing techniques. In conventional box or convection conveyor oven curing, it will cure at temperatures as low as 100ºC.


Applications Image Sensor & Camera Module Assembly, Thermal Cure
Laminate Packages Electrically Conductive Paste
CTEa1 (Below Tg) (ppm/°C) 94
Cure Schedule Temperature (°C) (Step 1) 150
Cure Schedule Time (Step 1) 2 min.
Cure Type Heat Cure
Key Characteristics Conductivity: Electrically Conductive
Number of Components 1 Part
Tg Dry (°C) 96
Viscosity (Brookfield mPa.s (cP)) 9500
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77
Warpage (m) 35 microns PBGA 500 x 500 x 15 mil