LOCTITE ABLESTIK 2033SC

Die attach adhesive is designed for high throughput smart card bonding applications. It is compatible with various encapsulant chemistries.


Applications Laminate Packages Electrically Non-Conductive Paste
Cure Schedule Temperature (°C) (Step 1) 110
Cure Schedule Time (Step 1) 90 sec.
Key Characteristics Conductivity: Electrically Non-Conductive
Thermal Conductivity (W/mK) 0.35