(Known as LOCTITE 3327UV )

LOCTITE 3327 has been developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with LOCTITE UV dam encapsulants, such as LOCTITE 3323. This combination of dam and fill will pass mechanical stress testing and high reliability tests; typically thermal shock cycling -55 °C to +125 °C and humidity heat aging 85 °C / 85 % RH.

Applications Fill Materials - Chip-on-Board
% Filler 40
Applications Wire Bonded Die Encapsulating
CTEa1 (Below Tg) (ppm/°C) 45
Cure Type UV Cure
Key Characteristics Purity: High Purity, Low Stress, Moisture Resistant
Storage Temperature (°C) 6
Tg Dry (°C) 110
Viscosity Range (Brookfield mPa.s (cP)) 6500 to 9500
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77