(Known as LOCTITE 3323UV )

LOCTITE 3323  has been developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with LOCTITE UV fill encapsulants, such as 3327 and 3329. Either combination of dam and fill will pass mechanical stress testing and high reliability tests; typically thermal shock cycling -55 °C to +125 °C and humidity heat aging 85 °C / 85 % RH.

Applications Dam Materials - Chip-on-Board
% Filler 43
Applications Wire Bonded Die Encapsulating
CTEa1 (Below Tg) (ppm/°C) 40
Cure Schedule Temperature (°C) (Step 1) 125
Cure Schedule Temperature (°C) (Step 2) 165
Cure Schedule Time (Step 1) 30 min.
Cure Schedule Time (Step 2) 90 min.
Cure Type UV Cure
Storage Temperature (°C) 6
Tg Dry (°C) 140
Viscosity Range (Brookfield mPa.s (cP)) 19000 to 46000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77