LOCTITE 3705 is a UV-cured adhesive designed for bonding electronics components on PCBs. Thixotropic nature reduces migration of product. Excellent adhesion to a wide range of substrate. Bonds in seconds upon exposure to UV light.

Applications Light Cure - Acrylic
Reworkable CSP Underfill, Other
Applications Edgebonding
CTEa1 (Below Tg) (ppm/°C) 157
Cure Type UV Cure
Key Characteristics Thixotropic
Pot Life Temperature (°C) 25
Pot Life Temperature (°F) 77
Pot Life Time 30 days
Storage Temperature (°C) 6
Tg Dry (°C) -44
Viscosity (Brookfield mPa.s (cP)) 40000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77