HYSOL US1150 is an extended polybutadiene/MDI base, mineral filled, medium hardness, ambient cure urethane encapsulant/sealant. This material can be used for potting electronics or devices for protection against environmental hazards. It exhibits very little hardness increase when cooled to -75ºC. It can be used for devices in the telecommunications and automotive industries. HYSOL US1150 meets UL 94V-0 rating. The 1 to 4 volume mix ratio makes meter-mix dispensing convenient.

Applications Urethane Encapsulants-Potting, Two Component
Agency Approvals / Specifications UL 94V-0
Color Black
Cure Type Room Temperature Cure
Mix Ratio 21:100
Number of Components 2 Part
Shore Hardness Durometer 60
Shore Hardness Scale A
Technology Urethane
Temperature Range (°C) -65 to 125
Thermal Conductivity (W/mK) 0.486
Viscosity (Brookfield mPa.s (cP)) 3500
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77