(Known as HYSOL E1216M )

LOCTITE E 1216M is a snap curable capillary flow underfill is designed for high volume assembly operations requiring a very fast flowing underfill that cures in a a single reflow cycle.  It is stable enough to be easily shipped and used in large volume cartridges up to 20 oz. It is used in CSP, BGA and Flip Chip BGA applications.  It is specifically formulated to eliminate anhydride-type curing agents for those who prefer to work with anhydride-free products.

Applications Reworkable CSP Underfill, Other
Applications Capillary Flow Underfill
CTEa1 (Below Tg) (ppm/°C) 40
Cure Schedule Temperature (°C) (Step 1) 150
Cure Schedule Time (Step 1) 3.5 min.
Key Characteristics Non-Reworkable
Pot Life Temperature (°C) 25
Pot Life Temperature (°F) 77
Pot Life Time 4 days
Storage Temperature (°C) -20
Tg Dry (°C) 115
Viscosity (Brookfield mPa.s (cP)) 3252
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77