Hysol 3329

Developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with Hysol® UV dam encapsulants, such as Hysol 3323. This combination of dam and fill will pass mechanical stress testing and high reliability tests; typically thermal shock cycling -55 °C to +125 °C and humidity heat aging 85 °C / 85 %

Applications Fill Materials - Chip-on-Board
% Filler 40
Applications Wire Bonded Die Encapsulating
CTEa1 (Below Tg) (ppm/°C) 45
Tg Dry (°C) 150
Viscosity (Brookfield mPa.s (cP)) 8000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77