Hysol ECCOBOND DX-20C

Eccobond DX-20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.


Applications Die Attach Adhesives Electrically Non-Conductive
General
Cure Schedule Temperature (°C) (Step 1) 170
Cure Schedule Time (Step 1) 60 min.
Cure Type Heat Cure
Pot Life Temperature (°C) 25
Pot Life Temperature (°F) 77
Pot Life Time 24 hr.
Shelf Life Time 6 mon.