HYSOL® ES1900™ is a two-component casting system with excellent handling properties. Transparent, medium-viscosity epoxy resin formulation recommended for small potting and laminating applications where clarity and excellent structural, mechanical and electrical properties are required.

Applications Epoxy Based
Potting & Encapsulating - Electronics
Color Clear
Cure Schedule Temperature (°C) (Step 1) 65
Cure Schedule Time (Step 1) 2 hr.
Cure Type Room Temperature Cure
Mix Ratio 100:46
Number of Components 2 Part
Pot Life Temperature (°C) 25
Pot Life Temperature (°F) 77
Pot Life Time 10 min.
Shore Hardness Durometer 90
Shore Hardness Scale D
Technology Epoxy
Thermal Conductivity (W/mK) 0.2
Viscosity (Brookfield mPa.s (cP)) 6000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77