(Known as MULTICORE CR37 solder paste )

LOCTITE CR 37 solder paste is suitable for most assembly processes.  It is suited to meet the demands of high volume production which utilizes components and boards having less than desirable levels of solderability.  It is proven to have greater process variation tolerance and a lower tendency to poor component wetting.  It is suitable for fine line stencil printing, has excellent slump resistance.  It is IPC Type-L formulation and meets ROL 1 to ANSI/J-STD-004.  It is available in a variety of alloys including Sn62, Sn63.

Applications Solder Paste