HYSOL® ES2500™ is a resilient, low cost, fast gelling potting compound. Ideal for potting and encapsulating high volume parts. Meets UL 94 HB Flame Retardant to 1.5mm thickness.

Applications Epoxy Based
Potting & Encapsulating - Electronics
Agency Approvals / Specifications UL 94 HB
Color Black
Cure Schedule Temperature (°C) (Step 1) 65
Cure Schedule Time (Step 1) 60 min.
Cure Type Room Temperature Cure
Mix Ratio 100:29.5
Number of Components 2 Part
Pot Life Temperature (°C) 25
Pot Life Temperature (°F) 77
Pot Life Time 10 min.
Shore Hardness Durometer 70
Shore Hardness Scale D
Technology Epoxy
Temperature Range (°C) -40 to 105
Thermal Conductivity (W/mK) 0.288
Viscosity (Brookfield mPa.s (cP)) 1500
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77