HYSOL ES2207

HYSOL® ES2207™ is a filled, resilient, low viscosity, room temperature cure epoxy potting compound. It will meet UL 94 V-0 requirements in 1/8 inch thickness.


Applications Epoxy Based
General
Potting & Encapsulating - Electronics
Agency Approvals / Specifications UL 94V-0
Color Black
Cure Schedule Temperature (°C) (Step 1) 65
Cure Schedule Time (Step 1) 2 hr.
Cure Type Room Temperature Cure
Mix Ratio 100:15.8
Number of Components 2 Part
Pot Life Temperature (°C) 25
Pot Life Temperature (°F) 77
Pot Life Time 90 min.
Shore Hardness Durometer 75
Shore Hardness Scale D
Technology Epoxy
Thermal Conductivity (W/mK) 0.4
Viscosity (Brookfield mPa.s (cP)) 8800
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77