LOCTITE ABLESTIK 2030SC

(Known as ABLESTIK ABLEBOND 2030SC )

Die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces.  It can be used in a variety of package sizes.


Applications Laminate Packages Electrically Conductive Paste
Cure Schedule Temperature (°C) (Step 1) 110
Cure Schedule Time (Step 1) 90 sec.
Electrical Conductivity (S/m) 2 x 10-4
Key Characteristics Conductivity: Electrically Conductive
Thermal Conductivity (W/mK) 2.3