(Known as Ablebond 2035SC )

LOCTITE ABLESTIK 2035SC is non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces.

Applications Die Attach
Laminate Packages Electrically Non-Conductive Paste
Cure Schedule Temperature (°C) (Step 1) 110
Cure Schedule Time (Step 1) 90 sec.
Cure Schedule Time (Step 2) 90 sec.
Key Characteristics Conductivity: Electrically Non-Conductive
Thermal Conductivity (W/mK) 0.35
Warpage (m) 34 microns PBGA 500 x 500 x 15 mil