(Known as ABLESTIK ABLEBOND 933-1 moisture resistant chip encapsulant )

LOCTITE ECCOBOND 933 one component epoxy encapsulant is designed for encapsulating microelectronic chips.  The low coefficient of thermal expansion minimized stress effects on components and wiring during thermal shock tests.  It exhibits a longer work life and a lower moisture sensitivity than the anhydride-cured system. 

Applications Electrically Non-Conductive Paste Encapsulants - Thermal Compression