LOCTITE ABLESTIK ABP 2100AC

(Known as ABP-2100AC (35g) )

LOCTITE ABLESTIK ABP 2100AC die attach adhesive is designed for Pb-free array packaging. This product is able to withstand the high reflow temperatures necessary for Pb-free solders at 260°C.  It is suitable for die sizes up to 12.7mm x 12.7mm. 


Applications Die Attach Adhesives Electrically Conductive
Heat Cure