ABLESTIK ABLEFILM ECF563

ABLESTIK ABLEFILM ECF563 unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required.  This adhesive provides RF/EMI shielding in bonding microwave substrates into packages.


Applications Electrically Conductive Film
Cure Schedule Temperature (°C) (Step 1) 150
Cure Schedule Time (Step 1) 30 min.
Key Characteristics Conductivity: Electrically Conductive, Conductivity: Thermally Conductive, Fiberglass Supported, Flexible
Physical Form Film
Shelf Life Time 6 mon.
Thermal Conductivity (W/mK) 1
Volume Resistivity (Ohm cm) 0.004