(Known as ABLESTIK ABLEBOND 2000 )

LOCTITE ABLESTIK 2000 electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging.  This product is able to withstand the high reflow temperatures necessary for Pb-free solders @ 260 Deg. C.  It is suitable for die sizes up to 12.7 x 12.7 mm.

Applications Die Attach Adhesives Electrically Conductive
Cure Type Heat Cure
Key Characteristics Conductivity: Electrically Conductive, Isotropic
Physical Form Paste
Pot Life Temperature (°C) 25
Pot Life Temperature (°F) 77
Pot Life Time 24 hr.
Shelf Life Time 12 mon.
Thermal Conductivity (W/mK) 1
Viscosity (Brookfield mPa.s (cP)) 9000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77
Volume Resistivity (Ohm cm) 0.0005