(Known as Ablebond 2035SC-1B1 )

LOCTITE ABLESTIK 2035SC-1B1 non-conductive, one component die attach adhesive was formulated for high throughput die attach applications. It is designed for die attach applications requiring good dielectric layer.  Designed to minimize stress and resulting warpage between dissimilar surfaces.   It is the 20 µm bondline version of LOCTITE ABLESTIK 2035SC adhesive.

Applications Die Attach
Laminate Packages Electrically Non-Conductive Paste