HYSOL ECCOBOND G757HF-D
HYSOL ECCOBOND G757HF-D is a low halogen, non-conductive epoxy adhesive for ferrite bonding applications. It is suitable for use with temperature sensitive substrates and components.
| Applications |
Electrically Non-Conductive |
| Cure Schedule Temperature (°C) (Step 1) | 180 |
| Cure Schedule Time (Step 1) | 10 min. |
| Cure Type | Heat Cure |
| Key Characteristics | Conductivity: Electrically Non-Conductive |
| Physical Form | Paste |
| Pot Life Temperature (°C) | 25 |
| Pot Life Temperature (°F) | 77 |
| Pot Life Time | 30 days |
| Shelf Life Time | 6 mon. |
