HYSOL ECCOBOND G757HF-D is a low halogen, non-conductive epoxy adhesive for ferrite bonding applications.  It is suitable for use with temperature sensitive substrates and components.

Applications Electrically Non-Conductive
Cure Schedule Temperature (°C) (Step 1) 180
Cure Schedule Time (Step 1) 10 min.
Cure Type Heat Cure
Key Characteristics Conductivity: Electrically Non-Conductive
Physical Form Paste
Pot Life Temperature (°C) 25
Pot Life Temperature (°F) 77
Pot Life Time 30 days
Shelf Life Time 6 mon.