HYSOL ECCOBOND G500

HYSOL ECCOBOND G500 is a general purpose epoxy adhesive and sealant that cures to a high gloss finish. It is used as insulation of copper and other materials and attaching leads to coils.


Applications Electrically Non-Conductive
Cure Schedule Temperature (°C) (Step 1) 175
Cure Schedule Time (Step 1) 5 min.
Cure Type Heat Cure
Key Characteristics Conductivity: Thermally Conductive, Performance: High Performance, Shimming: Non-Shimming
Number of Components 1 Part
Physical Form Paste
Shelf Life Time 5.5 mon.
Shelf Life °F 77
Technology Epoxy