HYSOL QMI516IE

HYSOL QMI516IE electrically conductive hydrophobic adhesive is designed for die attach applications.  It is a snap cure adhesive used in high throughput bonding applications.


Applications Snap Cure
Color Silver
Cure Schedule Temperature (°C) (Step 1) 90
Cure Schedule Time (Step 1) 60 min.
Cure Type Heat Cure
Key Characteristics Conductivity: Electrically Conductive
Physical Form Paste
Pot Life Temperature (°C) 25
Pot Life Temperature (°F) 77
Pot Life Time 6 hr.
Shelf Life Time 12 mon.
Viscosity (Brookfield mPa.s (cP)) 15000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77
Volume Resistivity (Ohm cm) 0.0015