HYSOL UF3810

HYSOL UF3810 reworkable epoxy underfill is designed for CSP and BGA applications. It  cures quickly at moderate temperatures to minimize stress to other components.  When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.


Technical Data Sheets (TDS)

Loctite Eccobond UF 3810 (Hysol UF3810)
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Additional Documents

PR 200 'High Tg, Reworkable Underfill from Henkel'
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UF3810 Sell Sheet
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