LOCTITE ECCOBOND 50500-1

(Known as Hysol STYCAST 50500-1 )

LOCTITE ECCOBOND 50500-1 is for protection of wire-bonded ICS, consider this flowable material for a fill.


Applications Fill Materials - Chip-on-Board
Glob Top Materials - Chip-on-Board
% Filler 75
CTEa1 (Below Tg) (ppm/°C) 20
Cure Schedule Temperature (°C) (Step 1) 150
Cure Schedule Time (Step 1) 60 min.
Key Characteristics Flow: High Flow
Tg Dry (°C) 140
Viscosity (Brookfield mPa.s (cP)) 35000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77