Hysol UF3800

(Known as HYSOL UF3800 reworkable underfill )

A high reliability, good reworkability, room temperature dispensable underfill compatible with most common solder pastes.


Applications Reworkable CSP Underfill, Capillary Flow
Underfiller
Applications Capillary Flow Underfill
CTEa1 (Below Tg) (ppm/°C) 52
Cure Schedule Temperature (°C) (Step 1) 130
Cure Schedule Time (Step 1) 8 min.
Key Characteristics Reworkable
Pot Life Temperature (°C) 25
Pot Life Temperature (°F) 77
Pot Life Time 3 days
Storage Temperature (°C) -20
Technology Epoxy
Tg Dry (°C) 69
Viscosity (Brookfield mPa.s (cP)) 375
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77