Ablestik ABLETHERM 3188

Conductive adhesive is designed for thermally enhanced BGA applications. Sensitive to amines. This material needs to be isolated from uncured epoxy-based resins as interaction will inhibit curing. It has a high silver loading and is not recommended for auger valve dispensing.


Applications Lid Attach
Cure Schedule Temperature (°C) (Step 1) 100
Cure Schedule Temperature (°C) (Step 2) 150
Cure Schedule Time (Step 1) 90 min.
Cure Schedule Time (Step 2) 60 min.
Key Characteristics Adhesion: High Adhesion, Cure Speed: Fast Cure, Filler: Ag Filled
Modulus GPa 3
Tg Dry (°C) -41
Thermal Conductivity (W/mK) 5.4
Viscosity (Brookfield mPa.s (cP)) 15000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77