Designed to continuously flow and form fillets after die placement is complete. The Self-Filleting feature is ideal for packages requiring narrower and more controlled fillets.

Applications Die Attach
Laminate Packages Electrically Non-Conductive Paste
Key Characteristics Conductivity: Electrically Non-Conductive
Moisture Resistance Testing (MRT) L2 / 260°C
Thermal Conductivity (W/mK) 0.4
Warpage (m) 4 x 300 x 300 mil Si die on PBGA - 14 microns