Designed to continuously flow and form fillets after die placement is complete. The Self-Filleting feature is ideal for packages requiring narrower and more controlled fillets.
Laminate Packages Electrically Non-Conductive Paste
|Key Characteristics||Conductivity: Electrically Non-Conductive|
|Moisture Resistance Testing (MRT)||L2 / 260°C|
|Thermal Conductivity (W/mK)||0.4|
|Warpage (m)||4 x 300 x 300 mil Si die on PBGA - 14 microns|