(Known as Ablestik ABLEBOND 2000B )

LOCTITE ABLESTIK 2000B is an electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging. This product is able to withstand the high reflow temperatures necessary for Pb-free solders @ 260°C. It is suitable for die sizes up to 12.7 x 12.7 mm.

Applications Laminate Packages Electrically Conductive Paste
Electrical Conductivity (S/m) 0.05
Key Characteristics Conductivity: Electrically Conductive
Moisture Resistance Testing (MRT) L2 / 260°C, L3 / 260°C
Thermal Conductivity (W/mK) 1
Warpage (m) 36 microns PBGA 500 x 500 x 15 mil