LOCTITE 3874 SY25ML

LOCTITE 3874 is a fast-curing, high-conductivity for bonding heat-generated devices to thermal spreader without glass beads.


Applications Lubricants
Non-Shimming Adhesives
Phase Change - Thermal Interface Materials
Cure Schedule Temperature (°C) (Step 1) 25
Cure Schedule Temperature (°F) (Step 1) 77
Cure Schedule Time (Step 1) 24 hr.
Cure Type Activator Cure, Heat Cure
Physical Form Paste
Shelf Life Time 10 mon.
Thermal Conductivity (W/mK) 1.25
Volume Resistivity (Ohm cm) 4.3 x 1014