Hysol FP5500

Heat cure material designed ACP process by thermal compression (RFID, Misc, Assembly).


Applications Electrically Non-Conductive Paste Encapsulants - Thermal Compression
CTEa1 (Below Tg) (ppm/°C) 51
Cure Schedule Temperature (°C) (Step 1) 200
Cure Schedule Time (Step 1) 4 sec.
Cure Type Heat Cure
Modulus GPa 4.6
Shelf Life Time 6 mon.
Storage Temperature (°C) -15
Tg Dry (°C) 121
Viscosity (Brookfield mPa.s (cP)) 40000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77