Hysol DC0114

DC0114 epoxy underfill is suitable for high reliability applications due to its combination of properties. It can be applied to ceramic or organic substrates, including solder masks and polyimide.

Applications CSP Underfill, Flip Chip on Flex & Flip Chip-on-Board
Flip-Chip on Flex Capillary
% Filler 13
CTEa1 (Below Tg) (ppm/°C) 70
Cure Schedule Temperature (°C) (Step 1) 165
Cure Schedule Time (Step 1) 30 min.
Tg Dry (°C) 135
Viscosity (Brookfield mPa.s (cP)) 20000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77