Hysol ECCOBOND G500HF

(Known as Hysol ECCOBOND G500HF )

General purpose one-component non-conductive epoxy adhesive and sealant that cures to a high gloss finish.


Applications General
Cure Schedule Temperature (°C) (Step 1) 175
Cure Schedule Time (Step 1) 5 min.
Cure Type Heat Cure
Key Characteristics General Purpose, Conductivity: Electrically Non-Conductive
Number of Components 1 Part
Physical Form Paste
Pot Life Temperature (°C) 25
Pot Life Temperature (°F) 77
Pot Life Time 4 min.
Shelf Life Time 4 mon.
Shelf Life °F 77